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Electronic Chemicals: Semiconductors, Silicon and IC Process Chemicals

Specialty Chemicals Update Program

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Published December 2023

The electronics industry uses a broad range of highly sophisticated specialty chemicals in many processing steps in the manufacture of electronic components and products, including silicon wafers and integrated circuits, for packaging and printed circuit boards (PCBs), in the manufacture of compound semiconductors and optoelectronics, and in the production of flat panel display products. This report covers the major specialty chemicals consumed in the production of integrated circuits or silicon chips, including silicon wafers, atmospheric and specialty gases, photoresists, ancillary chemicals, wet-processing chemicals, CMP slurries, thin film metals, copper plating chemicals, and new chemicals and precursor materials for low-k and high-k dielectrics.

In 2022, consumption of silicon wafers accounted for the largest share of total electronic chemicals consumption, followed by atmospheric and specialty gases, wet-processing chemicals, CMP slurries and pads, photoresist ancillary chemicals, photoresists, thin film metals and others. In 2022, the largest IC process chemical–consuming region was Taiwan, followed by South Korea, mainland China, the United States, Japan, Europe, the Middle East, and Southeast Asia and South Asia.

The following pie chart shows world consumption of IC process chemicals:

In 2000, about three-quarters of the world market for electronic chemicals was concentrated in the United States, Western Europe and Japan. This dominance rapidly eroded as other Asian nations emerged as producing regions, claiming a share of about 61% of world consumption of IC process chemicals in 2022. This trend was fueled by the growing global consumer electronics market, the growing consumer electronics production industry in Asia, and a strategy change of US, European and Japanese integrated device manufacturers that turned to asset-light or fabless strategies and outsourced production to foundries in Taiwan, South Korea, mainland China and Singapore.

Global consumption of IC process chemicals follows directly the growth of the semiconductor industry. Demand for semiconductors will be powered by the following technology trends:

  • Digitalization of industry and services
  • Rapid development of artificial intelligence (AI) will drive consumption of most advanced logic and memory chips
  • 5th-generation (5G) mobile network. This global standard for high-speed wireless connectivity enables faster communication between computers, smartphones, automobiles, industrial machines and home appliances, known as Internet of Things (IoT).
  • Automotive industry consumes more and more semiconductor devices: for assistance and entertainment systems, to improve engine efficiency and to improve performance of electric vehicles (longer range, faster charging, etc.).

In addition to the above technology drivers, consumption growth of IC processing chemicals will be directly driven by the construction of numerous new semiconductor fabs all over the world. Because modern chip fabs require huge investments, they are often supported by government policies such as the US CHIPS and Science Act, and the European Chips Act. This governmental support has gained importance since the major global semiconductors supply shortage in 2021 and 2022.

For more detailed information, please see the table of contents listed below.

S&P Global’s Specialty Chemicals Update Program –Electronic Chemicals—Semiconductors, Silicon, and IC Process Chemicals is the comprehensive and trusted guide for anyone seeking information into this industry. This latest report details global and regional information, including

Key benefits

S&P Global’s Specialty Chemicals Update Program –Electronic Chemicals—Semiconductors, Silicon, and IC Process Chemicals has been compiled using primary interviews with key suppliers and organizations, and leading representatives from the industry in combination with S&P Global’s unparalleled access to upstream and downstream market intelligence and expert insights into industry dynamics, trade, and economics.

This report can help you:

  • Identify the competitive environment and key players
  • Assess key issues facing both suppliers and their end-use customers
  • Understand industry integration strategies
  • Keep abreast of industry structure changes, regulatory requirements, and other factors affecting profitability
  • Identify new business opportunities and threats
  • Follow important commercial developments
  • Recognize trends and driving forces influencing specialty chemical markets
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Table of contents

Executive summary 11
Summary 12
North America 16
Europe and the Middle East 16
Mainland China 17
Japan 17
South Korea 17
Taiwan 18
Southeast Asia and South Asia 18
Introduction 19
Abbreviations 21
Overview of the semiconductor industry 24
World overview 24
Semiconductor markets 24
Semiconductor materials 29
First-generation semiconductors: silicon wafers 29
Second-generation semiconductors 32
Third-generation semiconductors: wide-band gap materials 32
Regional overview 33
North America 33
Industry structure 33
United States 35
Canada and Mexico 36
Industry market trends 36
Western Europe 37
Industry structure 37
Industry market trends 42
Central and Eastern Europe 43
Industry structure 43
Industry market trends 44
Eurasia 44
Industry structure 44
Industry market trends 46
Middle East 46
Industry structure 46
Industry market trends 47
Mainland China 47
Japan 52
Industry structure 52
Industry market trends 53
Electronic products 53
Semiconductors 54
South Korea 55
Company profile 55
Samsung Electronics 55
SK Hynix 56
Taiwan 56
Company profile 58
Taiwan Semiconductor Manufacturing Company Limited (TSMC) 58
United Microelectronics Corporation (UMC) 59
Southeast Asia 59
South Asia 61
Semiconductor manufacturing 62
Semiconductor substrates 62
Polysilicon and silicon wafers 62
Polysilicon 62
Monocrystal growth 62
Ingot slicing 62
Lapping, etching and polishing 63
Specialized processes 63
Cleaning and inspection 63
Silicon carbide and silicon carbide wafers 63
Raw material preparation 63
Crystal growth 63
SiC wafer slicing, lapping, polishing and cleaning 63
Epitaxial growth 64
Gallium nitride wafers 64
Wafers processing steps 64
Deposition 65
Patterning/photolithography 66
Removal (etching and chemical mechanical planarization) 66
Modification of electrical properties/implantation 66
Technology trends 67
Overview of the IC process chemicals industry 68
World overview 68
Structure of the industry 68
Operating characteristics 69
Research and development 69
Manufacturing 70
Marketing 70
Cost structure and profitability 71
Trends and opportunities 71
Technology 71
Business 72
Sustainability 72
Mergers and acquisitions 73
United States 75
Summary 75
Company profiles 75
Entegris 75
DuPont Electronics & Industrial 76
Government regulations 78
Critical factors for success 78
Europe and Middle East 79
Summary 79
Company profile — Siltronic AG 79
Company profile — Merck KGaA 81
Government regulations 83
Critical factors for success 84
Mainland China 85
Summary 85
Government regulations 85
Critical factors for success 86
Japan 86
Summary 86
Company profiles 86
JSR Corporation 86
Shin-Etsu Chemical Company 87
Sumitomo Chemical Co., Ltd. 89
Nippon Sanso Holding Corporation 90
Government regulations 91
Critical factors for success 91
South Korea 92
Company profile 92
SK Inc. 92
Dongjin Semichem 93
Government regulations 93
Taiwan 94
Company profile 94
GlobalWafers 94
Government regulations 94
Southeast Asia and South Asia 95
IC process chemicals — Product types and functions 96
Wafer substrates 96
Silicon wafer substrate 96
Silicon carbide and gallium nitride wafer substrate 96
Atmospheric and specialty gases 97
Blanket and carrier gases 97
Etchant and cleaning gases 98
Dopant gases containing group III/V elements 99
Precursors for silicon, tungsten and titanium compounds 99
Reactants and other semiconductor processes using specialty gases 99
DUV lithography 100
Photoresists 100
Photoresist ancillaries 103
Chemical mechanical planarization (CMP) slurries 103
CMP slurries 104
CMP pad 105
Wet-processing chemicals 105
Purity specifications 107
Thin film metals (metal sputtering) 108
Dielectric materials 109
Low-k dielectric materials 110
High-k dielectric materials/metal gates 110
Copper plating chemicals 111
Markets for IC process chemicals by region 113
United States 113
Summary 113
Wafer substrates 113
Consumption and markets 113
Market participants 114
Price 115
Atmospheric and specialty gases 115
Consumption and markets 115
Market participants 116
Price 117
Photoresists 117
Consumption and markets 117
Market participants 118
Price 119
Photoresist ancillaries 119
Consumption and markets 119
Market participants 120
Price 122
Chemical mechanical planarization (CMP) slurries 122
Consumption and markets 122
Market participants 122
Price 123
Wet-processing chemicals 124
Consumption and markets 124
Market participants 124
Price 125
Thin film metals (metal sputtering) 126
Consumption and markets 126
Market participants 126
Price 127
Low-k dielectric materials 127
Consumption and markets 127
Market participants 127
High-k dielectric materials 128
Consumption and markets 128
Market participants 128
Copper plating chemicals 129
Consumption and markets 129
Market participants 129
Western Europe 130
Summary 130
Wafer substrates 131
Consumption and markets 131
Market participants 131
Price 133
Atmospheric and specialty gases 133
Consumption and markets 133
Market participants 135
Price 136
Photoresists and ancillary chemicals 137
Consumption and markets 137
Market participants 138
Price 139
Chemical mechanical planarization (CMP) slurries 140
Consumption and markets 140
Market participants 141
Price 142
Wet-processing chemicals 142
Consumption and markets 142
Market participants 143
Price 144
Thin film metals (metal sputtering) 145
Consumption and markets 145
Market participants 145
Price 145
Low-k dielectric materials 145
Consumption and markets 145
Market participants 146
Price 146
High-k dielectric materials 146
Consumption and markets 146
Market participants 146
Copper plating chemicals 147
Consumption and markets 147
Market participants 147
Central and Eastern Europe 147
Eurasia 148
Middle East 149
Mainland China 150
Summary 150
Wafer substrates 151
Consumption and markets 151
Market participants 152
Price 154
Atmospheric and specialty gases 154
Consumption and markets 154
Market participants 156
Price 157
Photoresists and photoresist ancillaries 158
Consumption and markets 158
Market participants 159
Price 159
Chemical mechanical planarization (CMP) slurries 160
Consumption and markets 160
Market participants 160
Price 161
Wet-processing chemicals 161
Consumption and markets 161
Market participants 162
Price 163
Thin film metals (metal sputtering) 163
Market participants 163
Price 164
Other materials 164
Japan 164
Summary 164
Wafer substrates 165
Consumption and markets 165
Market participants 166
Price 168
Atmospheric and specialty gases 168
Consumption and markets 168
Market participants 170
Price 170
Photoresists 171
Consumption and markets 171
Market participants 172
Price 173
Photoresist ancillaries 173
Consumption and markets 173
Market participants 173
Chemical mechanical planarization (CMP) slurries and pads 174
Consumption and markets 174
Market participants 174
Price 174
Wet-processing chemicals 175
Consumption and markets 175
Market participants 176
Price 178
Thin film metals (metal sputtering) 178
Consumption and markets 178
Market participants 178
Price 179
Other materials 179
Consumption and markets 179
Market participants 180
Price 180
South Korea 181
Summary 181
Wafer substrates 182
Consumption and markets 182
Market participants 182
Price 182
Atmospheric and specialty gases 182
Consumption and markets 182
Market participants 182
Price 183
Photoresists and ancillary chemicals 183
Consumption and markets 183
Market participants 184
Price 185
Chemical mechanical planarization (CMP) slurries 185
Consumption and markets 185
Market participants 186
Price 186
Wet-processing chemicals 186
Consumption and markets 186
Market participants 187
Price 187
Thin film metals (metal sputtering) 188
Consumption and markets 188
Market participants 188
Price 188
Other materials 188
Consumption and markets 188
Market participants 189
Price 189
Taiwan 190
Summary 190
Wafer substrates 191
Consumption and markets 191
Market participants 191
Price 191
Atmospheric and specialty gases 191
Consumption and markets 191
Market participants 191
Price 191
Photoresists and ancillary chemicals 192
Consumption and markets 192
Market participants 193
Price 194
Chemical mechanical planarization (CMP) slurries 194
Consumption and markets 194
Market participants 194
Price 195
Wet-processing chemicals 195
Consumption and markets 195
Market participants 195
Price 195
Thin film metals (metal sputtering) 196
Consumption and markets 196
Market participants 196
Price 196
Other materials 197
Consumption and markets 197
Market participants 197
Price 198
Southeast Asia and South Asia 198
Summary 198
Wafer substrates 199
Consumption and markets 199
Market participants 199
Price 199
Atmospheric and specialty gases 200
Consumption and markets 200
Market participants 200
Price 200
Photoresists and ancillary chemicals 201
Consumption and markets 201
Market participants 202
Price 202
Chemical mechanical planarization (CMP) slurries 203
Consumption and markets 203
Market participants 203
Price 203
Wet-processing chemicals 204
Consumption and markets 204
Market participants 204
Price 204
Thin film metals (metal sputtering) 205
Consumption and markets 205
Market participants 205
Price 205
Other materials 206
Consumption and markets 206
Market participants 206
Price 206
Revisions 208
Data Workbook 209

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